EM SCD005
Cool Sputter Coater

Downlbad the brochure in PDF format.

Cool sputter Coater

The SCD005 Cool Sputter Coater, is a table top sputtering device for basic sputter-coating under rough-vacuum conditions.

Key Features

  • Compact bench unit
  • Fine grained films
  • Absolute personnel safety
  • Easy and safe operation
  • Very simple film thickness determination
  • Precisely reproducible film thickness
  • Easy, quick-target replacement
  • Precise sputtering process sequence
  • State-of-the-art-electronics
  • Universal application

Detailed Description

The Carbon-Metal-Carbon Evaporation Method

High resolution scanning electron microscopes often require extremely fine grained films to fully exploit their magnifying power. The high surface diffusion of sputtered gold or silver films (formation of "islands") do not meet this requirement. The method developed by Professor R. Blaschke, Universität Münster allows very fine-grained electrically conductive metal films to be applied to the specimen by first coating it with carbon.

A double carbon thread evaporator is pushed into the middle of the vacuum chamber. The carbon thread is "flash" evaporated, which coats the specimen with a thin carbon film. The carbon thread holder is then pulled back from the chamber, and the standard sputtering process is started. At a thickness of only 5-7 nm the metal film already envelops the structures on the specimen surface.

As the well-known "island" formation becomes evident again when the metal film is exposed to atmospheric conditions for several days, a second carbon film serves as a "preservative" for the sputtered metal film. This carbon film is applied by pushing the carbon thread evaporator back into the chamber and "flashing" the second carbon thread. This method allows carbon-metal carbon "sandwich" coatings to be applied without breaking the vacuum.

Compact bench unit

Space saving unit with all controls and displays integrated into a single console.

Fine grained films

Very high resolution films can be achieved because of the possibility for a "carbon-metal-carbon" process (accessory) as well as optimal adjustment of the freely selectable sputtering parameters.